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Functionally superior 3D packaging by Uflex is a head turner Functionality and aesthetics are undeniably important tactile and ocular factors playing a pivotal role in modern retail. Packaging besides containing and protecting the product, acts as the real ‘last mile salesperson’ on an already inundated retail shelf. A lot of responsibility vests on this salesperson in terms of getting noticed and subsequently picked up by the consumer.
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API to launch holography service for visual packaging solutions at LUXE PACK 2016 API is planning to launch custom decorative holography service – Holonique Boutique and its new Trends Yearbook at LUXE PACK Monaco this September.
Services > Design > News Cadence offers IC design solutions for fan-out wafer-level chip scale packaging By PKBR Staff Writer
Cadence Design Systems is offering complete IC packaging design and analysis solutions for advanced fan-out wafer-level chip scale packaging (WLCSP) and 2.5D interposer-based designs.
Services > Design > News
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